Design-Reliability Flow and Advanced Models Address IC-Reliability Issues
نویسندگان
چکیده
Welcome and Opening 8:30-8:40 Opening Remarks Adrian Evans IROC 8:40-8:50 Clereco Project Overview Stefano Di Carlo Politecnico di Torino 8:50-9:00 MoRV Project Overview Domenik Helms OFFIS Session I – Invited Talks Chair : Dimitris Gizopoulos – University of Athens 9:00-9:45 The Resilience Wall: CrossLayer Solutions Subhasish Mitra Stanford University 9:45:10:30 Reliability Challenges for Large ASICs Yongsheng Sun, HiSilicon Session II – Poster Session Moderator : Domenik Helms OFFIS 10:30-10:45 Poster Introduction 10:45-11:00 Poster Presentations and Coffee Break Session III – Tool Demos Moderator : Praveen Raghavan 11:00-11:15 Tool Demos Session IV – Invited Talks Chair : Alberto Bosio LIRMM 11:15-12:00 Reliability and Safety Challenged for Automotive Devices Wu-Tung Cheng, Mentor Graphics
منابع مشابه
Tuna Tarim Chair, Tutorial Committee Texas Instruments
There will be four tutorial tracks on the first day of the 2003 International Symposium on Quality Electronics Design. The tutorials included in these tracks are selected among the most popular topics in today's electronics industry. The IEEE Computer Society TTTC Test Technology Educational Program continues to support ISQED with tutorials on test topics. TTTC will be organizing the tutorial t...
متن کاملReliability challenges in 3D IC packaging technology
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.031 E-mail address: [email protected] At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order ...
متن کاملAdvanced Methodologies for Reliability - Based Design Optimization and Structural Health Prognostics
Title of Document: ADVANCED METHODOLOGIES FOR RELIABILITY-BASED DESIGN OPTIMIZATION AND STRUCTURAL HEALTH PROGNOSTICS. Pingfeng Wang, Doctor of Philosophy, 2010 Directed By: Dr. Byeng D. Youn, Assistant Professor, Department of Mechanical Engineering. Failures of engineered systems can lead to significant economic and societal losses. To minimize the losses, reliability must be ensured througho...
متن کاملFully Process-Compatible Layout Design on Bond Pad to Improve Wire Bond Reliability in CMOS ICs
During manufacture of wire bonding in packaged IC products, the breaking of bond wires and the peeling of bond pads occur frequently. The result is open-circuit failure in IC products. There were several prior methods reported to overcome these problems by using additional process flows or special materials. In this paper, a layout method is proposed to improve the bond wire reliability in gene...
متن کاملArchitecture Simulation Framework for 3D IC
The practical limitation of implementing 3-dimensional integrated circuits is the increased thermal stress. The integration of liquid cooling with 3D IC can solve the thermal problems, allowing up to 1,000W/cm of power density [1, 2]. Thus, the significant performance improvement can be made through 3D ICs and liquid cooling integration. However, increased transistor and power density will addr...
متن کامل